OPTOELECTRONIC COMPONENT MAKERS ADD NEW MEMBER COMPANIES
TO 10GB TRANSPONDER MULTI-SOURCE AGREEMENT GROUP

FOR RELEASE: MONDAY, MARCH 19, 2001

ANAHEIM, Calif. - Agere Systems (formerly known as the Microelectronics Group of Lucent Technologies), Alcatel Optronics, and Opnext (formerly Hitachi Fibre Optic Devices Operations) today announced an expanded multi-source agreement for 10 gigabit-per-second (Gbit/s) transponder modules used in optical networking systems. It adds Agilent, Ericsson Components AB, Mitsubishi Electric, JDS Uniphase, NEC and ExceLight (a subsidiary of Sumitomo Electric Industries) to an agreement signed last March by Alcatel Optronics, Opnext and Agere Systems. The expanded agreement allows all of these optoelectronic manufacturers to supply communications system providers with internationally compatible sources of 10 Gbit/s transponders to meet industry demand for high-speed fiber-optic communications components.

The transponders are optical transmitters and receivers in a single package that can be used in synchronous optical network/synchronous digital hierarchy (SONET/SDH) and dense wavelength division multiplexing (DWDM) systems, inter- and intra-office metropolitan rings, optical add/drop multiplexers, and Internet Protocol (IP) switches and routers. They combine lasers and photodetectors with high-speed integrated circuits to perform functions such as clock synthesis, clock recovery and multiplexing and demultiplexing of 16 x 622-megabit-per-second (Mbit/s) channels.

Under terms of the agreement, transponders from all of the companies must conform to specified packaging dimensions and pin functionality, and they must meet or exceed specified optical and electrical characteristics. The agreement allows for all types of devices (VSR, IR, LR, & WDM) to be available using the same design platform. The companies involved in the agreement all have an optics manufacturing capability in-house.

Makers of optical networking systems find transponder modules attractive, because this highly integrated packaging approach can cut several months of system development and manufacturing time, consume less power and increase port densities over board-level solutions built from discrete components. But with so much functionality in one module, timely and sufficient component supply becomes even more essential for successful system delivery. By extending this multi-source agreement to include nine major global component suppliers, systems makers can feel more confident about getting the components they need and being able to incorporate them without costly and time-consuming system redesigns.

The companies involved in this multi-source agreement are exhibiting their optoelectronic components at the Optical Fiber Communications (OFC) conference, being held in Anaheim, California March 19-21.

For further information, customers may contact the following company representatives by e-mail:
Agere Systems: John Bell,
stcjb@lucent.com
Alcatel Optronics: Arnaud Fardoit,
arnaud.fardoit@alcatel.fr
Opnext: Atsushi Takai,
atsushi.takai@opnext.com
Agilent: Dan Rausch,
dan_rausch@agilent.com
Ericsson: Torbjorn Palm,
torbjorn.palm@mic.ericsson.se
Mitsubishi: Shinji Shibao,
shinji.shibao@kama.melco.co.jp
JDS Uniphase: Tony Musto,
Tony.Musto@us.jdsuniphase.com
Sumitomo: Gregg Cockroft,
gcockroft@excelight.com
NEC: Tetsuyuki Suzaki,
tet-suzaki@cj.jp.nec.com

 

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